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Products |
The following list is of some of the products that we represent at Alltek Company for the Chinese market |
Manual Wire and Die Bonders Semi-Automatic Wire Bonders Automatic Wire Bonders Pull Test Machines |
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Tesla: On-Wafer Power Device Characterization System DC/CV Parameter Extraction RF Parameter Extraction Flicker Noise Analysis Multi-port/Differential Probing Wafer-Level Reliability Failure Analysis / Design Debug Signal Integrity / Package Test |
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| RF Device Characterization Solutions Manual and Automatic Tuners, Load Pull and Noise Characterization Integration with Cascade Probe Stations Precision VNA Calibration Kits & Components RF Coaxial & Waveguide Adapters Noise Calibration Systems and Equipment
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Projection Welders Parallel Seam Sealers Spot Welders Lid Tackers Snap-tite Compennet Insulators |
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Automatic Die Bonders Wire Bond Inspection Flexible Epoxy and Eutectic Placement with Highest Accuracy Die-Attach and Flip-Chip Bonding with Maximum Flexibility |
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vacuum/pressure furnaces wafer bonders graphite machining services
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UV Exposure Systems High-speed automatic Die Bonders The Eaglie Omni bonder Flip Chip Placement System Manual Pick & Place System |
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Automated Curve Tracer and DC Parametric System AutoTrace Compact Low-Cost Automated Curve Tracer MegaTrace High-Pin Count Latchup Tester and DC Parametric System Lab KitsPrecision Cross-Section Instrument Precision Parallel Lapping Instrument |
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Stationary Processing Equipmen Precision Parallel Lapping Instrument |
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Automatic Bonding Tools Access Series Insulated Wire Bonding Tools Large Wire Bonding Tools Manual Bonding Tools Micro - BGA tools (Tessera) Ribbon Bonding Tools TAB Bonding Tools Vertical Feed / Deep Access Tools |
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Image Reversal Tools High Temperature Vacuum Ovens Plasma Strip/Descum Systems Plasma Cleaning Systems Stainless Steel Process Cassettes |
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InfraScope Hot Spot Detection Laser Signal Injection Emmi Photon Emission Detection |
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PIND, Particle Impact Noise Detection Vibration Systems Mechanical Shock Test System |
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Printers Automation Conveyor/Dryers Vision Alignment Roller Micrometers |
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Micro Resistance Welding Micro Arc Droplet Deposition Micro joining equipment ranging from stand alone units up to fully automated systems |
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Non-contact profile measurement Comprehensive profile measuring and 3D analysis. |
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Photovoltaic Metallization Firing Potovoltaic Phosphorous Diffusion Advanced Materials Semiconductor Packaging Optics & Display |
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High Temperature Vacuum Controlled Furnace Hot treating Hot Pressing Sintering |
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YAG lasers OEM systems for trimming and marking customised machines for the hybrid and SMD technology markets and the marking industry |
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Turn Key Production on Wafer DC Parametric Analyzers PCM testers, Reliability testers, GaAs Transistor testers Automatic wafer prober integration
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Optical Leak Test Systems Laser Holographic Leak Test Systems
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