Alltek Sells Semiconductor Packaging Assembly Testing Equipment in China. Microwave, Hybrid, T/R Modules, Optoelectronics, SAW, MEMS, Power Devices, MCMS, wire bonder, ball bonder, die bonder, flip chip bonder, probe station, projection welder, parallel seam sealer, high temperature/vacuum oven, plasma cleaner, and thermal image system.

The following are turn-key project that Alltek Company USA, Inc. is offering:

Turn-key Project for Microwave and Hybrid Assembly and Test Production Line

Turn-key Project for Nanotech, and MEMS Assembly and Test Production Line

Turn-key Project for Thin/Thick Film Assembly Line

Turn-key Project for Manual and Automatic SAW Assembly and Test Production Line

Turn-key Project for BGA, PGA, COB, SOB Assembly Line

Turn-key Project for Manual and Automatic Power Device Assembly Line

Turn-key Project for Automobile Circuit Manual and Automatic Assembly Line

Turn-key Project for Manual and Automatic Photonic Devices Assembly Line

Turn-key Project for Manual and Automatic Semiconductor Device Assembly Line

Turn-key Project for Wafer-level Assembly Line

Turn-key Project for MCM-C, MCM-D, MMC-M Assembly Line

Turn-key Project for ASIC Assembly Line

Turn-key Project for LTCC

If you need further information, process report or budgetary quote, please feel free to contact us.

Thank you for your cooperation!